Applications
Photovoltaics
Our TEGO® Surten E wetting agents and defoamers enhance the performance of the photovoltaic wafer cutting process by enabling a faster and better cut quality at much lower dosing rates.
We provide many different wetting agents for a wide variety of industries gathering decades of technical expertise. We strive for new developments by utilizing the full range of our technology platforms from siloxanes and branched polyesters, to alkoxylated alcohols and diols.
Geared towards finding the right balance between the lowest dynamic surface tension and surface contact angle, our latest wetting agents are designed for the latest high-performance photovoltaic cutting processes. Put simply, our products remove the cutting (swarf) quickly and effectively but are also durable enough to ensure an economic and more sustainable operation.
Our commercially available products are already considered best-in-class and cutting fluid formulations containing TEGO® Surten E can achieve drastically improved diamond wire sawing (DWS) cut quality ratios at much faster cutting speeds, even with the smallest wire diameters at the lowest dosing rates. Yet, we continue to strive to meet the individual formulation needs together with our partners and customers to evolve as the photovoltaic semiconductor industry transforms and places more performance requirements on the cutting process.
WATCH OUR VIDEO TO LEARN MORE ABOUT our WETTING AGENTS FOR PHOTOVOLTAIC WAFER CUTTING
Wetting agents and other high-performance surfactants acting as process additives enhance many related and emerging photovoltaic applications. Improvements in anti-reflective and reflecting dipping and coating processes, as well as post-treatment of cut wafers in terms of polishing and surface modification can be achieved by better wetting ensuring optimum semiconductor performance. The right mix of wetting agents can also contribute to the production of the emerging aesthetic decorative photovoltaics for a wider acceptance in the urban area.