Applications

Packaging

Specialty additives from Evonik deliver new performance properties to packaging materials.

Many consumers hardly give it a moment’s thought, but modern packaging is a high-tech product: sensitive electronics are protected by special plastic packaging that does not become statically charged. Food packaging is manufactured in such a way that it does not fog up to ensure an appealing presentation is maintained, and of course it also has sound hygienic advantages: It means that there is no build-up of condensation, which could drop onto the packaged product and increase bacteria levels.

Our specialty additives impart new properties to packaging materials made of plastic and enable their use in multiple scenarios. A masterbatch is used to ensure ease of processing of the performance additives. The defined blends, in which the basic packaging materials and additives are present in a fixed proportion are supplied with our ACCUREL® products. They also ensure the necessary dosage accuracy and that the additive is distributed evenly throughout the entire packaging material.

Special additives such as TEGOMER® 6810 and TEGOMER® 6850 provide even greater sustainability in the manufacture of packaging materials. As process aids (polymer processing additives, PPA), they improve the mechanical and optical properties of the finished packaging material and the performance of the production process. Additives based on organo-modified siloxanes provide a more ecological alternative to the previously used fluorine-based additives.

Packaging labelling

We also have solutions for modern self-adhesive labels based on our siliconized carrier material on which our UV-hardened silicones are designed to ensure that the label easily separates from the carrier material. The latest TEGO® RC silicone technology enables more ecological linerless labels that do not need a release liner. Not only does this increase the efficiency and flexibility in the labeling process, but it also improves the packaging industry’s ecological footprint by reducing waste and CO2 in the production process, logistics, transport and waste disposal.

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