Applications
Chips & Sensors
Evonik’s wide range of chemistries enables our extensive product portfolio specifically designed for electronic applications like chips and sensors.
The continued miniaturization of semiconductor chips and sensors for broader electronic applications areas demand better electrical and thermal management capabilities.
Our portfolio supports this progress and includes solutions for thermal management and semiconductor packaging.
Thermal management applications are driven by high momentum from the e-mobility market and our specialty additives and solutions focus on improving the thermal and electrical performance.
Typical thermal management applications enhanced by our solutions
- Thermal interface materials for battery assembly
- Electric motor potting
- Sensor potting
Semiconductor packaging applications are driven by high dynamics and demand in miniaturization.
Typical applications we serve for semiconductor packaging
- Conformal coating
- Underfill / die attach
- Different types of encapsulations
Our solutions for Copper Clad Laminate (CCL) applications face a high demand driven by 5G technology with high frequency demand and the need for high electrical performance.
Typical applications we serve for Copper Clad Laminate
- Rigid CCL prepreg
- Flexible CCL adhesion